<?xml version="1.0" encoding="utf-8"?>		<!-- generator="InstaScript v2.0" -->
		<rss version="2.0" 
		xmlns:content="http://purl.org/rss/1.0/modules/content/"
		xmlns:wfw="http://wellformedweb.org/CommentAPI/"
		xmlns:dc="http://purl.org/dc/elements/1.1/"
		xmlns:trackback="http://madskills.com/public/xml/rss/module/trackback/"
		xmlns:creativeCommons="http://backend.userland.com/creativeCommonsRssModule"
		xmlns:media="http://search.yahoo.com/mrss/"
		xmlns:itunes="http://www.itunes.com/dtds/podcast-1.0.dtd"
		xmlns:geo="http://www.w3.org/2003/01/geo/wgs84_pos#"
		xmlns:amp="http://www.adobe.com/amp/1.0"
		xmlns:dcterms="http://purl.org/dc/terms/"
		xmlns:gm="http://www.google.com/schemas/gm/1.1">

		<channel>
		<title>Rcp-technology - Latest Popular Stories, Instablogs Community </title>
		<link>http://www.instablogs.com/rcp-technology/</link>
		<description>Rcp-technology - Latest Popular Stories powered by Instablogs Community.</description>
		<image>
			<url>http://www.instablogs.com/site-img/insta-slogo.gif</url>
			<title>Instablogs Community</title>
			<link>http://www.instablogs.com/rcp-technology/</link>
		</image>
		<language>en-us</language>
		<generator>Instascript 2.0 http://www.instablogs.com</generator>
		<lastBuildDate>
		Thu, 27 Jul 2006 06:07:51 +0000		</lastBuildDate>
					<item>
				<title>Redistributed Chip Packaging method allows 3G phone electronics in single chip</title>
									<link>http://ritus.instablogs.com/entry/redistributed-chip-packaging-method-allows-3g-phone-electronics-in-single-chip/</link>
					<guid isPermaLink="true">http://ritus.instablogs.com/entry/redistributed-chip-packaging-method-allows-3g-phone-electronics-in-single-chip/</guid>
				
				<dc:creator>Ritu</dc:creator>
								<description><![CDATA[<img src="" align="right" /><p>	Freescale claimed that they have made a &#8216;breakthrough&#8217; in integrated circuit packaging. The Redistributed Chip Packaging method allowed making component, which contains all electronics for a 3G phone in a single package of 25&#215;25...</p>]]></description>

				<content:encoded><![CDATA[	<p>Freescale claimed that they have made a &#8216;breakthrough&#8217; in integrated circuit packaging. The Redistributed Chip Packaging method allowed making component, which contains all electronics for a 3G phone in a single package of 25&#215;25 millimeter.</p>
	<p>Freescale...
</p>
]]></content:encoded>
				<pubDate>Thu, 27 Jul 2006 06:07:51 +0000</pubDate>
				<category>Freescale</category><category>Redistributed Chip Packaging</category><category>BGA</category><category>3G mobile phones</category>								
			</item>
					</channel>
		</rss>
			